i ntegrated c ircuits d ivision www.ixysic.com ds-PLA160-r07 1 PLA160 single pole, normally open optomos ? relay applications features description ordering information parameter rating units maximum turn-on/turn-off times 50 ? s blocking voltage 300 v p load current 50 ma rms / ma dc on-resistance (max) 100 ? pin configuration part number description PLA160 6-pin dip (50/tube) PLA160s 6-pin surface mount (50/tube) PLA160str 6-pin surface mount (1,000/reel) switching characteristics of normally open (form a) devices PLA160 is a 300v, 50ma, 100 ? 1-form-a relay. this performance leader features the fastest switching speed (50 ? s) available in an optomos relay. ? fastest switching optomos relay, 50 ? s ? 3750v rms input/output isolation ? low drive power requirements (ttl/cmos compatible) ? no moving parts ? high reliability ? arc-free with no snubbing circuits ? fcc compatible ? no emi/rfi generation ? small 6-pin dip package ? machine insertable, wave solderable ? surface mount tape & reel version available ? flammability classification rating of v-0 ? instrumentation ? multiplexers ? data acquisition ? electronic switching ? i/o subsystems ? meters (watt-hour, water, gas) ? medical equipment?patient/equipment isolation ? security systems ? aerospace ? industrial controls ? reed relay replacement approvals ? ul recognized component: file # e76270 ? csa certified component: certificate # 1175739 ? en/iec 60950 certified component: tuv certificate b 13 12 82667 003 form-a i f i load 10% 90% t on t off 1 3 2 4 5 6 + control C control do not use load do not use load ac/dc configuration 1 3 2 4 5 6 + control C control do not use + load C load dc only configuration
i ntegrated c ircuits d ivision www.ixysic.com 2 r07 PLA160 absolute maximum ratings @ 25oc electrical characteristics @ 25oc absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. parameter ratings units blocking voltage 300 v p reverse input voltage 5 v input control current 50 ma peak (10ms) 1 a input power dissipation 1 150 mw total power dissipation 2 800 mw isolation voltage, input to output 3750 v rms operational temperature -40 to +85 c storage temperature -40 to +125 c 1 derate linearly 1.33 mw / o c 2 derate linearly 6.67 mw / o c parameter conditions symbol min typ max units output characteristics load current (continuous) ac/dc configuration -i l - - 50 ma rms / ma dc dc configuration - - 80 ma dc peak load current t=10ms i lpk - - 200 ma p on-resistance ac/dc configuration i f =50ma r on - 60 100 ? dc configuration i f =80ma - 15 30 off-state leakage current v l =300v i leak --25 na v l =100v - 1 10 switching speeds turn-on i f =10ma, v l =10v t on - 25 50 ? s turn-off t off 42 output capacitance 50v, f=1mhz c out -3 - pf input characteristics input control current to activate i l =50ma i f - 1.35 10 ma input control current to deactivate - i f 0.4 1.25 - ma input voltage drop i f =10ma v f 1.8 2.4 2.8 v reverse input current v r =5v i r - - 10 a common characteristics input to output capacitance - c i/o -3 - pf
i ntegrated c ircuits d ivision PLA160 www.ixysic.com 3 r07 *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written specifications, please contact our application department. performance data @ 25oc (unless otherwise noted) * typical led forward voltage drop (n=50) 35 30 25 20 15 10 5 0 2.34 2.38 2.42 2.46 2.50 led forward voltage drop (v) device count (n) turn-on time ( p s) 19 21 23 25 27 29 31 device count (n) 0 5 10 15 20 25 turn-on time distribution (n=50, i f =10ma, i l =50ma) turn-off time ( p s) 38 40 42 44 46 48 device count (n) 0 5 10 15 20 25 30 turn-off time distribution (n=50, i f =10ma, i l =50ma) typical i f for switch operation (n=50, i l =50ma dc ) 1.1 1.5 0.9 1.3 1.7 1.9 led current (ma) device count (n) 30 25 20 15 10 5 0 typical i f for switch dropout (n=50, i l =50ma dc ) 30 25 20 15 10 5 0 1.1 1.5 0.9 1.3 1.7 1.9 led current (ma) device count (n) typical on-resistance distribution (n=50, i f =10ma, i l =50ma dc ) 35 30 25 20 15 10 5 0 60 62 64 65 61 63 on-resistance ( : ) device count (n) typical blocking voltage distribution (n=50) 18 16 14 12 10 8 6 4 2 0 335 345 355 365 340 350 blocking voltage (v p ) device count (n) 360 typical led forward voltage drop vs. temperature temperature (oc) led forward voltage drop (v) -40 3.6 3.2 2.8 2.4 2.0 1.6 -20 0 20 40 60 80 120 100 i f =50ma i f =30ma i f =20ma i f =10ma led current (ma) 0 1020304050 turn-on time ( p s) 5 10 15 20 25 30 35 40 45 typical turn-on time vs. led forward current (v l =10v, i l =50ma) led current (ma) 0 1020304050 turn-off time ( p s) 38 40 42 44 46 48 50 typical turn-off time vs. led forward current (v l =10v, i l =50ma)
i ntegrated c ircuits d ivision www.ixysic.com 4 r07 PLA160 *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written specifications, please contact our application department. performance data @ 25oc (unless otherwise noted) * temperature (oc) -40 -20 0 20 40 60 80 100 turn-on time ( p s) 5 10 15 20 25 30 35 typical turn-on time vs. temperature (v l =10v) i f =10ma i f =20ma temperature (oc) -40 -20 0 20 40 60 80 100 turn-off time ( p s) 30 35 40 45 50 55 typical turn-off time vs. temperature (v l =10v) i f =10ma i f =20ma typical on-resistance vs. temperature (i l =50ma dc , i f =10ma) temperature (oc) on-resistance ( : ) -40 80 70 60 50 40 30 20 10 -20 0 20 40 60 80 100 typical i f for switch operation vs. temperature (i l =50ma dc ) temperature (oc) led current (ma) -40 6 5 4 3 2 1 0 -20 0 20 40 60 80 100 typical i f for switch dropout vs. temperature (i l =50ma dc ) temperature (oc) led current (ma) -40 6 5 4 3 2 1 0 -20 0 20 40 60 80 100 typical load current vs. load voltage (i f =10ma) load voltage (v) load current (ma) 50 40 30 20 10 0 -10 -20 -30 -40 -50 -3 -2 -1 0 1 2 3 maximum load current vs. temperature temperature (oc) load current (ma) 80 70 60 50 40 30 20 10 0 -40 -20 0 20 40 60 80 120 100 i f =20ma i f =10ma i f =5ma typical blocking voltage vs. temperature temperature (oc) blocking voltage (v p ) -40 380 375 370 365 360 355 350 345 340 335 -20 0 20 40 60 80 100 typical leakage vs. temperature measured across pins 4&6 (v l =300v p ) temperature (oc) leakage ( p a) -40 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0 -20 0 20 40 60 80 100 energy rating curve time load current (a) 10 p s 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 1ms 100 p s 100ms 1s 10ms 10s 100s
i ntegrated c ircuits d ivision PLA160 www.ixysic.com 5 r07 manufacturing information moisture sensitivity all plastic encapsulated semiconductor packages are susceptible to moisture ingression. ixys integrated circuits division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . device moisture sensitivity level (msl) rating PLA160 / PLA160s msl 1 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . soldering profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device maximum temperature x time PLA160 / PLA160s 250oc for 30 seconds board wash ixys integrated circuits division recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. since ixys integrated circuits division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. chlorine- or fluorine-based solvents or fluxes should not be used. cleaning methods that employ ultrasonic energy should not be used.
i ntegrated c ircuits d ivision www.ixysic.com 6 r07 PLA160 dimensions mm (inches) pcb hole pattern 6.350 0.127 (0.250 0.005) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) 5.080 0.127 (0.200 0.005) 6 - 0.800 dia. (6 - 0.031 dia.) 0.254 0.0127 (0.010 0.0005) 9.144 0.508 (0.360 0.020) 7.239 typ (0.285 typ) 7.620 0.254 (0.300 0.010) 3.302 0.051 (0.130 0.002) 4.064 typ (0.160 typ) 0.457 0.076 (0.018 0.003) 8.382 0.381 (0.330 0.015) 2.54 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 1.651 0.254 (0.065 0.010) pin 1 dimensions mm (inches) pcb land pattern 0.254 0.0127 (0.010 0.0005) 7.620 0.254 (0.300 0.010) 0.635 0.127 (0.025 0.005) 3.302 0.051 (0.130 0.002) 4.445 0.254 (0.175 0.010) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 8.382 0.381 (0.330 0.015) 2.54 0.127 (0.100 0.005) 9.524 0.508 (0.375 0.020) 6.350 0.127 (0.250 0.005) 0.457 0.076 (0.018 0.003) 1.651 0.254 (0.065 0.010) 1.651 0.254 (0.065 0.010) pin 1 mechanical dimensions PLA160 PLA160s
i ntegrated c ircuits d ivision specification: ds-PLA160-r07 ?copyright 2015, ixys integrated circuits division optomos ? is a registered trademark of ixys integrated circuits division all rights reserved. printed in usa. 5/13/2015 for additional information please visit our website at: www.ixysic.com 7 PLA160 ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity a re expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infri ngement of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the right to discontinue or make changes to its p roducts at any time without notice. notes: 1. all dimensions carry tolerances of eia standard 481-2 2. the tape complies with all notes for constant dimensions listed on page 5 of eia-481-2 dimensions mm (inches) embossment embossed carrier 330.2 dia (13.00 dia) top cover tape thickness 0.102 max (0.004 max) w=16.00 (0.63) b 0 = 10.10 (0.398) a 0 = 10.10 (0.398) p = 12.00 (0.472) k 1 = 3.80 (0.15) k 0 = 4.90 (0.19) user direction of feed PLA160str tape & reel
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